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Toray resin technology increases the reliability of electronic device componentsDramatically Improved Bonding Is Achieved Between the PPS Resin and the Sealing Material

Electronic device parts require the use of epoxy resins and silicone resins as sealants for conductor materials. Sufficient bonding between the high-performance thermoplastic resin used for manufacturing the exterior of an electronic component and the resin used for sealing it is extremely important in ensuring the reliability of the component.

Contents

  1. Electronic Control Components That Combine Material Technologies Present Unique Challenges
  2. The Importance of Material Selection When in Bonding PPS Resin with Epoxy Sealing Materials
  3. Toray PPS Resin and Excellent Epoxy Resing Binding
  4. Three Times More Adhesion than Conventional PPS Resin
  5. Key Points for Improving the Adhesion of Silicone Sealants
  6. Materials That Improve the Quality and Productivity of Electronic Control Components