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As CPUs and GPUs generate increasing amounts of heat, AI data centers are increasingly adopting liquid cooling systems using cold plates.
At the same time, more advanced cooling systems require a growing number of components, such as cold plates, manifolds, and housings, creating challenges including increased weight, complex machining and assembly processes, higher costs, and metal corrosion.
This white paper introduces Toray's solutions for replacing metal cooling components with resin in AI data centers by combining high-performance PPS resin “TORELINA™” with bonding technology and CAE analysis to address these challenges.