Secondary processing

Ⅰ. Machining

Boring holes
Bore holes using a standard metal-boring drill. Turn the drill at 600-3,000 rpm for a 4-6 mm hole or 1,000-1,500 rpm for an 8-13 mm hole. Cool appropriately to avoid heat build-up.
Cutting and lathe-turning
A lathe-turning machine for metal applications can easily lathe our resin. Whether using high-speed steel or ultra-hard steel—either turning tool will work on TORAYCON™. The shape of the turning tool should have a side rake or a rake angle of 3° or less to reduce heat build-up and provide a sufficient escape for shavings.
A lathe turning speed of 30-100 m/min is generally suitable.
Sawing
A saw with coarse teeth and a large pitch between teeth is most suitable. For circular saws, 1-2 teeth/cm and a speed of 0.5-1 m/min is appropriate. Cool the portion to be cut or take other measures as appropriate to prevent heat build-up.
Filing, grinding and buffing
A file, grinder or buffer may also be used on TORAYCON™. Be careful to avoid heat build-up caused by friction.

Ⅱ. Adhesion

Ultrasonic welding, spin-welding or an adhesive can be used to adhere TORAYCON™.
Ultrasonic welding is simple and the preferred adhesive technique. TORAYCON™ is crystalline, has a high melting point and solidifies quickly, so use special techniques on the joining surface or horn to achieve higher adhesive strength.
Epoxy or cyanoacrylate adhesives are suitable when bonding PBT to PBT or PBT to another resin.

White paper

Simultaneous Pursuit of Heat Dissipation/Electromagnetic Wave Shielding/Airtightness and Weight ReductionProposal of Metal-Resin Joining Technology that will Contribute to the Production of New Products

While integrally molding metal and resin makes it possible to design products having both the heat dissipation and electromagnetic wave shielding characteristics of metal and the lightweight and easy processability characteristics of resin, ensuring airtightness is a major issue.This is a summary of a metal-resin joining technology designed to resolve this issue, and an introduction of use examples and anticipated future applications for this technology.

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