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LCP für MID-Festkörperanwendungen
The market for LDS (laser direct structuring), a MID (molded interconnect device) method, is expected to expand in line with the increasing number of communications devices, and an increasing number of antennas installed for multi-frequency communications.
Through Toray’s proprietary compound technology, we have developed an LCP material well suited to the highly flexible MID method, making it possible to add a selective plated layer to the surface of molded resin products (LDS).
White Paper
Simultaneous Pursuit of Heat Dissipation/Electromagnetic Wave Shielding/Airtightness and Weight ReductionProposal of Metal-Resin Joining Technology that will Contribute to the Production of New Products
While integrally molding metal and resin makes it possible to design products having both the heat dissipation and electromagnetic wave shielding characteristics of metal and the lightweight and easy processability characteristics of resin, ensuring airtightness is a major issue.This is a summary of a metal-resin joining technology designed to resolve this issue, and an introduction of use examples and anticipated future applications for this technology.
Metal-free electromagnetic protection for electronic components!Electromagnetic Shielding Characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic Resin
Electromagnetic countermeasures are becoming more challenging as the number of electronic devices increases due to the widespread introduction of 5G, IoT and ADAS, etc. Toray presents the characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic resin with superior electromagnetic shielding and provides application case studies to show how we solve these challenges.
Gehäuse
| Rohstoff | TORAYCON™ PBT Polymer |
|---|---|
| Materialtype | 2107G-X01 |
| Materialeigenschaften / Eignung für die Anwendung | Metal Bonding Property, Chemikalienbeständigkeit |
| Rohstoff | TORAYCON™ PBT Polymer |
|---|---|
| Materialtype | 4107G-X01, 2107G-X02 |
| Materialeigenschaften / Eignung für die Anwendung | Metal Bonding Property |
Antenne
| Rohstoff | SIVERAS™ LCP resin |
|---|---|
| Materialtype | LD70M25 |
| Materialeigenschaften / Eignung für die Anwendung | Designfreiheit, niedrige dielektrische Verlusttangente, Applikationsverkleinerung, SMD-Montage |
Steckverbinder
| Rohstoff | SIVERAS™ LCP resin |
|---|---|
| Materialtype | LX80T35 AF |
| Materialeigenschaften / Eignung für die Anwendung | Festigkeit, Hitzebeständigkeit, gutes Fließverhalten |
| Rohstoff | SIVERAS™ LCP resin |
|---|---|
| Materialtype | LX80M25 AH |
| Materialeigenschaften / Eignung für die Anwendung | gutes Fließverhalten, Hitzebeständigkeit |
Gehäuse
| Rohstoff | TORAYCON™ PBT Polymer |
|---|---|
| Materialtype | 2107G-X01 |
| Materialeigenschaften / Eignung für die Anwendung | Metal Bonding Property, Chemikalienbeständigkeit |
| Rohstoff | TORAYCA™ CFRTP |
|---|---|
| Materialtype | PC-CF（Long Fiber） |
| Materialeigenschaften / Eignung für die Anwendung | geringer Verzug, V-0, leicht |