Electronics
The evolution of electronic devices, including semiconductors, smartphones, and PCs, is supported by
excellent material technologies. In particular, resin materials with excellent heat resistance, voltage
resistance, and moldability are indispensable for power semiconductors and semiconductor manufacturing
equipment.
Toray provides resin materials equipped with excellent properties that realize precise design and highly
efficient manufacturing processes, contributing to improving the performance of electronic devices.
- Power Semiconductors
- Semiconductor Manufacturing Equipment (Chemical-related)
- Semiconductor Manufacturing Equipment
- Smartphones / PCs
Power Semiconductors
With the spread of EVs (electric vehicles) and renewable energy, the demand for next-generation power
semiconductors is rapidly expanding, and materials capable of handling high voltage and large current (high
current density) are required.
Toray's resins possess excellent heat resistance and insulation performance, maintaining stable performance
even in severe operating environments. They are used in a wide range of applications, such as components for
EV inverters, quick charging stations, energy-saving home appliances, and industrial motor control devices.
Power Modules
Power module cases and frames are required to have high heat resistance and insulation performance
capable of withstanding operating temperatures of 150°C to 200°C. In addition, as downsizing and higher
voltages progress, requirements for tracking resistance are also increasing.
Toray's PPS resin maintains high insulation properties and dimensional stability even in
high-temperature environments, exhibiting excellent performance compared to other materials such as PPA.
Grades
Achieving CTI Rank 0 and realizing the highest level of heat dissipation among PPS, it has overcome
tracking resistance, which was a weakness of conventional PPS resins.
It is chosen by many customers for applications requiring insulation properties, tracking resistance,
high heat dissipation, and high dimensional accuracy.
Related Information
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PPS resin tracking resistance achieving "CTI Rank 0"
Newly developed grades
In response to the voices of customers eager for a material that combines tracking resistance and heat cycle resistance, it is a new material that crosses each technology and balances them at a high level.
Semiconductor Manufacturing Equipment (Chemical-related)
Semiconductor manufacturing equipment includes components where metals cannot be used depending on the
chemicals used. Currently, fluororesin with excellent chemical resistance is mainstream, but in recent
years, environmental regulations, especially countermeasures against PFAS (organic fluorine compounds), have
become an urgent issue. In addition, inside the equipment, contamination resistance and dust resistance for
wafers have become important needs.
Toray provides TORELINA™ (PPS resin) and TORAYCA™ resin (CFRTP) instead of fluororesins to solve these
challenges.
Chemical Pumps, Valves, and Flowmeters
Pump housings of semiconductor manufacturing equipment require chemical resistance and low elution of
metal ions.
Toray provides resin materials with excellent strength, rigidity, and lightweighting, realizing the
optimization of housing design, product lightweighting, and further effective utilization of
installation space.
Grades
In semiconductor manufacturing equipment, the use of glass fiber reinforced resins is restricted to prevent wafer damage. This grade is an unfilled PPS material, and while having chemical resistance equivalent to fluororesins, it possesses properties superior to fluororesins in terms of high strength, high rigidity, and low specific gravity.
This is a TORAYCA™ resin grade in which carbon fiber is compounded into PPS resin. Combining excellent strength, high heat resistance, low impurities, long-term high-temperature properties, and also antistatic properties, it is effective as a countermeasure against wafer contamination and damage due to static electricity. It is also resistant to strong chemicals such as hydrofluoric acid.
This is a grade in which glass fiber and elastomer are compounded into PPS resin. It is recommended for applications such as pumps, valves, and flowmeters used for supplying coolants such as propylene glycol, ethylene glycol, and pure water.
Semiconductor Manufacturing Equipment
Toray's resins are also widely used in semiconductor manufacturing processes. Because they have excellent chemical resistance, antistatic properties, and abrasion resistance, are suitable for use in clean environments, and contribute to equipment efficiency and energy saving due to their light weight and high rigidity, they have been adopted in many equipment components to date, supporting semiconductor manufacturing.
Carrier Trays
Carrier trays are important components that support the safe movement of materials such as wafers. Toray's resins propose optimal materials according to the properties required in each process, such as chemical resistance, antistatic properties, and abrasion resistance.
Grades
A representative grade of TOYOLACPAREL™. Through proprietary polymer alloy technology, it realizes high
antistatic performance and is increasingly adopted in carrier tray applications.
We offer a wide lineup including transparent grades and colored grades, making it possible to propose
both hard trays and soft trays.
Newly developed grades
Modified PPE is widely used for carrier trays, but Toray has developed a new grade in which special fillers are compounded into PBT resin. We propose new value for this application.
Coaters
In the coating process, uniform application and precise control are indispensable.
Toray's resins possess chemical resistance, low outgassing, and high-precision moldability, exhibiting
stable performance even in clean environments. Being lightweight and highly rigid, they improve durability
while reducing the load on the equipment, supporting high-quality semiconductor manufacturing.
Grades
This is a grade in which glass fiber and elastomer are compounded into PPS resin. It realizes excellent chemical resistance and high roundness, contributing to the prevention of cracking during wafer cleaning. It also excels in the polishability of molded products, supporting accuracy improvement in the chemical application process.
Smartphones / PCs
In the smartphone and PC fields, component lightweighting, high durability, and designability are required,
and the demand for high-performance resins to meet these needs is rapidly increasing.
Toray's resins combine excellent moldability and impact resistance, and are widely used from precision
components to exterior panels. We also focus on the development of environmentally friendly materials,
supporting sustainable product creation. Through the latest adoption examples and customization proposals,
we contribute to strengthening product competitiveness.
Housing
Resin materials used for smartphone and PC housings contribute to improving product strength through
light weight and high durability.
Toray's PPS resin excels in heat resistance, flammability, and dimensional stability, making it
particularly suitable for molding precision components. In addition, it enhances the degree of design
freedom even in notebook PCs, which are becoming thinner and lighter for portability convenience,
achieving both higher performance and improved design.
Grades
This is a grade in which PBT resin and other resins are mixed, and further compounded with glass fiber. It is a special grade that realizes metal bonding strength and chemical resistance at a high level, and is adopted in many smartphone housings.
This is a grade in which glass fiber is compounded into a special PPS resin with low chlorine elution. While the number of resin housings is increasing for the purpose of lightweighting, concerns about chlorine elution are also rising, so Toray developed this to clear these regulations. In addition to PC applications, it is increasingly adopted in peripheral components such as mini breakers.
This is a grade in which glass fiber and inorganic filler are compounded into LCP resin with high melt flowability. It is optimal for narrow-pitch connectors and FPC connectors that require high flowability and low warpage.
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You can view materials related to products and methods that support product development in the electronics industry.
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Our domestic and international technical support centers provide consistent support from resin selection to design, analytical evaluation, and follow-up after market launch.