Product design support & Processing technology
Waterproof x Vibration-less x Short tact time!!What are PBT and PPS resins, suitable for laser welding methods?
Electronic Device Components are increasing in functionality, which creates new challenges for joining the thermoplastic resin components while maintaining high quality and high efficiency. This brochure provides material solutions using PBT and PPS materials, which produce high laser weld strength to deliver stronger, higher quality components while minimizing the impact of heat and stress during the welding process.
Technology advancements in high-performance laser welding resin thermoplasticsUsage and characteristics of laser weldable PBT and PPS
Laser welding of thermoplastics is becoming preferred methods to enhance quality of components manufacturing. Here, we will explain the advancements in PBT and PPS compounds are used for laser welding method including the unique features.
Toray resin technology increases the reliability of electronic device componentsDramatically Improved Bonding Is Achieved Between the PPS Resin and the Sealing Material
Electronic device parts require the use of epoxy resins and silicone resins as sealants for conductor materials. Sufficient bonding between the high-performance thermoplastic resin used for manufacturing the exterior of an electronic component and the resin used for sealing it is extremely important in ensuring the reliability of the component.
Simultaneous Pursuit of Heat Dissipation/Electromagnetic Wave Shielding/Airtightness and Weight ReductionProposal of Metal-Resin Joining Technology that will Contribute to the Production of New Products
While integrally molding metal and resin makes it possible to design products having both the heat dissipation and electromagnetic wave shielding characteristics of metal and the lightweight and easy processability characteristics of resin, ensuring airtightness is a major issue.This is a summary of a metal-resin joining technology designed to resolve this issue, and an introduction of use examples and anticipated future applications for this technology.