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Data Centers
Data centers, as infrastructure that processes enormous amounts of information stably at high speeds,
require highly reliable and efficient operations. To cope with increasing data volumes and
higher-performance equipment, countermeasures against heat and improvement in durability of the equipment
are required.
Toray provides resin materials with excellent flammability, heat resistance, and electrical insulation
properties, realizing lightweighting and high durability for housings, cooling systems, and internal
structural components. We also contribute to the reduction of environmental impact, supporting the
sustainable operation of next-generation data centers.
Cooling Fans (Housings / Blades)
Cooling fans are important components that efficiently dissipate heat from increasingly dense servers
and support the stable operation of data centers. In recent years, as power consumption reduction and
noise reduction are required, the adoption of lightweight and highly durable resin materials is
advancing.
Toray's resins enable high-precision blade design due to excellent moldability, supporting the evolution
of cooling fans that rotate at high speeds. They also excel in heat resistance and durability, handling
continuous long-term operation and contributing to the improvement of cooling efficiency.
Grades
This is a grade in which glass fiber is compounded into PBT resin. It is generally adopted for cooling fan housings and blades, and is chosen by many customers based on its long track record.
This is a grade in which glass fiber is compounded into PPS resin. Due to the high rigidity specific to PPS resin, it minimizes blade deflection and realizes high blowing performance.
Cooling Manifolds, Fittings, and Valves
Cooling manifolds, fittings, and valves in data centers require high durability and chemical
resistance.
Toray's resins combine lightweighting and durability, and by further imparting low ion elution
properties, they support the long-term stable operation of cooling components. In addition, we can
propose various designs and shapes utilizing our track record of cooling components cultivated in the
mobility and consumer fields, as well as our know-how in replacing metals with resins.
Grades
This is a grade that maintains fluid cleanliness with low ion elution and realizes high moldability that also enables undercut design. Furthermore, it possesses high durability to withstand impacts from water hammers, and is suitable for cooling manifold applications requiring resistance to pure water and propylene glycol.
Related Information
Product Information
TORELINA™ PPS resin for water applications
Cooling Pipes
Along with the increase in power consumption accompanying the increase in data processing volume, the
adoption of various liquid cooling systems as more efficient cooling methods is increasing. In water
cooling systems, the demand for pipes to supply coolant is increasing.
Through the proposal of resins having excellent hot water resistance and chemical resistance, Toray
achieves both lightweighting and high durability of cooling pipes, contributing to the higher efficiency
of cooling systems.
Grades
B670 SF1 B1
Using Toray's proprietary technology, we have developed a PPS with the world's highest level of flexibility while maintaining the excellent heat resistance and chemical resistance of PPS resin. It can also accommodate bellows shapes, and you can consider it for cooling pipes with good handling properties.
High-speed Communication Connectors
For high-speed communication in data centers, connectors that ensure stable transmission are
indispensable, and low dielectric properties that suppress signal degradation are required for their
housings.
Because Toray's resins excel in flowability and enable precision molding, they realize high-density
mounting of connector housings. Also, because they are resistant to heat, deformation and warpage are
unlikely to occur even in high-temperature environments, enabling long-term use.
Grades
This is a grade in which glass fiber and inorganic filler are compounded into LCP resin, featuring high toughness, low outgas, and low warpage. Due to the excellent flowability specific to LCP resin, it is suitable for thin-wall molding and insert molding, realizing high-density mounting and component downsizing.
Newly developed grades
This is a grade in which glass fiber and inorganic filler are compounded into LCP resin. It adopts recycled resin and contributes to reducing the carbon footprint while maintaining flowability and low warpage, which are the conventional strengths of SIVERAS™ LCP resin.
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You can view materials related to products and methods that support product development in the energy and infrastructure industry.
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