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Telecommunications
Featured grades
LCP for Solid Substrate Applications for MIDs
The market for LDS (laser direct structuring), a MID (molded interconnect device) method, is expected to expand in line with the increasing number of communications devices, and an increasing number of antennas installed for multi-frequency communications.
Through Toray’s proprietary compound technology, we have developed an LCP material well suited to the highly flexible MID method, making it possible to add a selective plated layer to the surface of molded resin products (LDS).
White Paper
Simultaneous Pursuit of Heat Dissipation/Electromagnetic Wave Shielding/Airtightness and Weight ReductionProposal of Metal-Resin Joining Technology that will Contribute to the Production of New Products
While integrally molding metal and resin makes it possible to design products having both the heat dissipation and electromagnetic wave shielding characteristics of metal and the lightweight and easy processability characteristics of resin, ensuring airtightness is a major issue.This is a summary of a metal-resin joining technology designed to resolve this issue, and an introduction of use examples and anticipated future applications for this technology.
Metal-free electromagnetic protection for electronic components!Electromagnetic Shielding Characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic Resin
Electromagnetic countermeasures are becoming more challenging as the number of electronic devices increases due to the widespread introduction of 5G, IoT and ADAS, etc. Toray presents the characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic resin with superior electromagnetic shielding and provides application case studies to show how we solve these challenges.
Housing
Resin | TORAYCON™ PBT resin |
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Grade | 2107G-X01 |
Material Features / Reasons of Adoption | Metal Bonding Property, Chemical Resistance |
Resin | TORAYCON™ PBT resin |
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Grade | 4107G-X01, 2107G-X02 |
Material Features / Reasons of Adoption | Metal Bonding Property |
Antenna
Resin | SIVERAS™ LCP resin |
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Grade | LD70M25 |
Material Features / Reasons of Adoption | Design Flexibility, Low Dielectric Loss Tangent, Downsizing, SMT |
Connector
Resin | SIVERAS™ LCP resin |
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Grade | LX80T35 AF |
Material Features / Reasons of Adoption | High Strength, Heat Resistance, Flowability |
Resin | SIVERAS™ LCP resin |
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Grade | LX80M25 AH |
Material Features / Reasons of Adoption | Flowability, Heat Resistance |
Housing
Resin | TORAYCON™ PBT resin |
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Grade | 2107G-X01 |
Material Features / Reasons of Adoption | Metal Bonding Property, Chemical Resistance |
Resin | TORAYCA™ CFRTP |
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Grade | PC-CF(Long Fiber) |
Material Features / Reasons of Adoption | Low Warpage, V-0, Light Weight |