Telecommunications

Featured grades

LCP for Solid Substrate Applications for MIDs

The market for LDS (laser direct structuring), a MID (molded interconnect device) method, is expected to expand in line with the increasing number of communications devices, and an increasing number of antennas installed for multi-frequency communications.
Through Toray’s proprietary compound technology, we have developed an LCP material well suited to the highly flexible MID method, making it possible to add a selective plated layer to the surface of molded resin products (LDS).

Further details

White Paper

Simultaneous Pursuit of Heat Dissipation/Electromagnetic Wave Shielding/Airtightness and Weight ReductionProposal of Metal-Resin Joining Technology that will Contribute to the Production of New Products

While integrally molding metal and resin makes it possible to design products having both the heat dissipation and electromagnetic wave shielding characteristics of metal and the lightweight and easy processability characteristics of resin, ensuring airtightness is a major issue.This is a summary of a metal-resin joining technology designed to resolve this issue, and an introduction of use examples and anticipated future applications for this technology.

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Metal-free electromagnetic protection for electronic components!Electromagnetic Shielding Characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic Resin

Electromagnetic countermeasures are becoming more challenging as the number of electronic devices increases due to the widespread introduction of 5G, IoT and ADAS, etc. Toray presents the characteristics of TORAYCA™ Carbon Fiber Reinforced Thermoplastic resin with superior electromagnetic shielding and provides application case studies to show how we solve these challenges.

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Housing

ResinTORAYCON™ PBT resin
Grade2107G-X01
Material Features /
Reasons of Adoption
Metal Bonding Property, Chemical Resistance
ResinTORAYCON™ PBT resin
Grade4107G-X01, 2107G-X02
Material Features /
Reasons of Adoption
Metal Bonding Property
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Antenna

ResinSIVERAS™ LCP resin
GradeLD70M25
Material Features /
Reasons of Adoption
Design Flexibility, Low Dielectric Loss Tangent, Downsizing, SMT
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Connector

ResinSIVERAS™ LCP resin
GradeLX80T35 AF
Material Features /
Reasons of Adoption
High Strength, Heat Resistance, Flowability
ResinSIVERAS™ LCP resin
GradeLX80M25 AH
Material Features /
Reasons of Adoption
Flowability, Heat Resistance
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Housing

ResinTORAYCON™ PBT resin
Grade2107G-X01
Material Features /
Reasons of Adoption
Metal Bonding Property, Chemical Resistance
ResinTORAYCA™ CFRTP
GradePC-CF(Long Fiber)
Material Features /
Reasons of Adoption
Low Warpage, V-0, Light Weight
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